Ultra-precision surface grinder that achieves high flatness, high smooth surface, low damage layer, and integrated machining process
Usage
300mmウェーハの超精密平面研削
material
silicon wafer
Benefit
In pursuit of rigidity, two horizontal processing heads are arranged in a space-saving manner.
By adopting a horizontal groove that pursues rigidity, it achieves high flatness and low damage grinding of the silicon wafer surface, reduces the load in the post-process, and improves total productivity.
High-rigidity air static pressure spindles are used for grinding wheel spindles and workpiece spindles.